Low-melt is applied at 265° F. to bond heat sensitive substrates such as polystyrene foam. 40 second bonding range when dispensed at low-melt temperature.
Bonds wood, corrugated, polyolefins and other light-weight materials.
FDA listed.
8″ – 3M™ 3792LMQ Low-Melt Glue Sticks (11Lbs/Case)
Low-melt is applied at 265° F. to bond heat sensitive substrates such as polystyrene foam.
Additional information
| Weight | 17.94 lbs |
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