Low-melt is applied at 265° F. to bond heat sensitive substrates such as polystyrene foam. Excellent “hot-tack” when dispensed at low-melt temperatures.
Can bond expanded polystyrene, corrugated packaging and displays.
25 second bonding range.
FDA listed.
8″ – 3M™ 3762LMQ Low-Melt Glue Sticks (11Lbs/Case)
Low-melt is applied at 265° F. to bond heat sensitive substrates such as polystyrene foam.
Additional information
| Weight | 18.15 lbs |
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